Modellnummer
Multilayer PCB Manufacturer
Kupferne Stärke
0.5-6 oz, 0.25 Oz -6 Oz
Min. Loch-Größe
0.2 mm (8 mil)
Min. Linie Breite
4mil (0.1mm)
Min. Zeilenabstand
4mil (0.1mm)
Oberflächenvollenden
HASL / HASL lead free, HAL, Chemical tin,
Base Material
FR-4/aluminum/ceramic
Copper Thickness
0.25 Oz -6 Oz
Material
FR4 /aluminum/ceramic CEM1
Solder mask
Green. Red. Blue. White. Black.Yellow
Product name
Printed Circuit Board
Application
Electronics Device